Patent Assignment
Reel/Frame 051909/0874
Assignment of Assignor's Interest
Recorded: 2020-02-24
Pages: 5
Assignors
CHANG CHIEN, CHIEN LIN
Executed: 2020-02-19
LEE, CHIU-WEN
Executed: 2020-02-19
TU, HUNG-JUNG
Executed: 2020-02-19
LEE, CHANG CHI
Executed: 2020-02-19
KAO, CHIN-LI
Executed: 2020-02-19
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package Including Thermal Dissipation Element and Method of Manufacturing the Same