Patent Assignment
Reel/Frame 051914/0254
Assignment of Assignor's Interest
Recorded: 2020-02-25
Pages: 4
Assignor
INAMASU, TOSHIFUMI
Executed: 2020-02-13
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Substrate Processing Method and Bonding Method