Assignment of Assignor's Interest

Recorded: 2020-02-25 Pages: 4

Assignor

Executed: 2020-01-20

Assignee

EPISTAR CORPORATION

21, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN

Covered Properties (3)

Light Emitting Diode Package Structure and Method for Fabricating the Same

Patent: 7,923,746 →

Application: 12/126,935 →

Publication: US 2009/0230417

Light Emitting Diode Package Structure and Method for Fabricating the Same

Patent: 8,115,218 →

Application: 12/501,496 →

Publication: US 2009/0267102

Method for Fabricating a Light Emitting Diode Package Structure

Patent: 8,349,627 →

Application: 12/976,977 →

Publication: US 2011/0092002

Related Assignments (1)

Other recorded transfers of the patents in this record — the chain of ownership.