Patent Assignment
Reel/Frame 051947/0990
Assignment of Assignor's Interest
Recorded: 2020-02-27
Pages: 5
Assignors
LIU, WEIFENG
Executed: 2020-02-18
TAN, JESUS A.
Executed: 2020-02-18
UY, WILLIAM L.
Executed: 2020-02-18
SHANGGUAN, DONGKAI
Executed: 2020-02-18
Assignee
FLEX LTD.
2 CHANGI SOUTH LANE, SINGAPORE, 486123, SINGAPORE
Covered Property
(1)
Methods, Devices, and Systems for Electronic Device Molding and Encapsulation