Patent Assignment
Reel/Frame 051952/0047
Assignment of Assignor's Interest
Recorded: 2020-02-27
Pages: 4
Assignors
YOKOYAMA, TAKAHIRO
Executed: 2019-11-01
MATSUFUJI, TAKAHIRO
Executed: 2019-11-01
NOMURA, HIKARU
Executed: 2019-11-13
YOSHIKAWA, SHUNSAKU
Executed: 2019-11-01
Assignee
SENJU METAL INDUSTRY CO., LTD.
23, SENJU-HASHIDO-CHO, ADACHI-KU, TOKYO, 120-8555, JAPAN
Covered Property
(1)
Solder Alloy, Solder Paste, Solder Ball, Resin Flux-Cored Solder and Solder Joint