Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint
The present invention provides a solder alloy, a solder paste, a solder ball, a resin flux-cored solder and a solder joint, both of which has the low-melting point to suppress the occurrence of the fusion failure, improves the ductility and the shear strength, and has excellent heat-cycle resistance. The solder alloy comprises an alloy composition composed of 35 to 68 mass % of Bi, 0.1 to 2.0 mass % of Sb, 0.01 to 0.10 mass % of Ni, and a balance of Sn. The alloy composition may contain at least one of Co, Ti, Al and Mn in total amount of 0.1 mass % or less. The solder alloy may be suitably used for a solder paste, a solder ball, a resin flux-cored solder and a solder joint.
1. A solder alloy comprising an alloy composition consisting of 35 to 68 mass % of Bi, 0.1 to 2.0 mass % of Sb, 0.01 to 0.10 mass % of Ni, and a balance of Sn,
wherein the alloy composition satisfies the following relationship (1),
0.0250≤Ni/Sb≤0.0429 or 0.0600≤Ni/Sb≤0.0714 (1)
wherein, in the relationship (1), Ni and Sb represent each content in the solder alloy (mass %), and
wherein the solder alloy does not contain Cu.
2. The solder alloy according to claim 1 , wherein the alloy composition further contains at least one of Co, Ti, Al and Mn in total amount of 0.1 mass % or less.
3. The solder alloy according to claim 1 , wherein the alloy composition further contains at least one of P, Ge, and Ga in total amount of 0.1 mass % or less.
4. A solder paste comprising a solder alloy comprising an alloy composition comprising 35 to 68 mass % of Bi, 0.3 to 1.0 mass % of Sb, 0.01 to 0.05 mass % of Ni, and a balance of Sn,
wherein the alloy composition satisfies the following relationship (1),
0.0250≤Ni/Sb≤0.0429 or 0.0600≤Ni/Sb≤0.0714 (1)
wherein, in the relationship (1), Ni and Sb represent each content in the solder alloy (mass %), and
wherein the solder alloy does not contain Cu.
5. A solder ball comprising a solder alloy comprising an alloy composition comprising 35 to 68 mass % of Bi, 0.3 to 1.0 mass % of Sb, 0.01 to 0.05 mass % of Ni, and a balance of Sn,
wherein the alloy composition satisfies the following relationship (1),
0.0250≤Ni/Sb≤0.0429 or 0.0600≤Ni/Sb≤0.0714 (1)
wherein, in the relationship (1), Ni and Sb represent each content in the solder alloy (mass %), and
wherein the solder alloy does not contain Cu.
6. A resin flux-cored solder comprising the solder alloy according to claim 1 .
7. A solder joint comprising the solder alloy according to claim 1 .
8. The solder alloy according to claim 1 , wherein the alloy composition satisfies the following relationship (1),
0.0250≤Ni/Sb≤0.0429 (1)
wherein, in the relationship (1), Ni and Sb represent each content in the solder alloy (mass %).
9. The solder alloy according to claim 1 , wherein the alloy composition satisfies the following relationship (1),
0.0600≤Ni/Sb≤0.0714 (1)
wherein, in the relationship (1), Ni and Sb represent each content in the solder alloy (mass %).
10. The solder alloy according to claim 3 , wherein the alloy composition contains 0.003 to 0.05 mass % of P.
11. The solder alloy according to claim 3 , wherein the alloy composition contains 0.005 to 0.1 mass % of Ga.
12. The solder alloy according to claim 3 , wherein the alloy composition contains 0.005 to 0.01 mass % of Ga.
13. The solder alloy according to claim 3 , wherein the alloy composition further contains 0.005 to 0.01 mass % of Ge.
14. The solder alloy according to claim 1 , wherein the solder alloy does not simultaneously contain both Al and Ag.