Patent Assignment
Reel/Frame 051956/0498
Assignment of Assignor's Interest
Recorded: 2020-02-27
Pages: 3
Assignors
PATIL, ANIKET
Executed: 2020-02-26
WANG, ZHIJIE
Executed: 2020-02-26
WE, HONG BOK
Executed: 2020-02-26
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Package Comprising a Substrate and a High-Density Interconnect Structure Coupled to the Substrate