Patent Assignment
Reel/Frame 051960/0391
Assignment of Assignor's Interest
Recorded: 2020-02-28
Pages: 6
Assignors
JEON, GWANGJAE
Executed: 2020-02-05
KIM, DONGKYU
Executed: 2020-02-05
PARK, JUNG-HO
Executed: 2020-02-05
JANG, YEONHO
Executed: 2020-02-05
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package with Thick Under-Bump Terminal