Patent Assignment
Reel/Frame 051962/0359
Assignment of Assignor's Interest
Recorded: 2020-02-28
Pages: 6
Assignors
CHO, YONGHOE
Executed: 2020-01-29
LEE, CHUNGSUN
Executed: 2020-01-29
JUNG, YOONHA
Executed: 2020-01-29
JO, CHAJEA
Executed: 2020-01-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including an Image Sensor Chip and a Method of Fabricating the Same