Patent Assignment
Reel/Frame 051972/0860
Assignment of Assignor's Interest
Recorded: 2020-03-02
Pages: 4
Assignors
WU, CHIH-WEI
Executed: 2020-02-18
LU, SZU-WEI
Executed: 2020-02-20
SHIH, YING-CHING
Executed: 2020-02-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Package Component, Electronic Device and Manufacturing Method Thereof