Patent Assignment
Reel/Frame 051977/0274
Assignment of Assignor's Interest
Recorded: 2020-03-02
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2020-02-20
PAN, KUO LUNG
Executed: 2020-02-03
CHUN, SHU-RONG
Executed: 2020-02-03
LAI, CHI-HUI
Executed: 2020-02-05
KUO, TIN-HAO
Executed: 2020-02-05
TSAI, HAO-YI
Executed: 2020-02-03
LIU, CHUNG-SHI
Executed: 2020-02-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Bonding Passive Devices on Active Device Dies to Form 3D Packages