Patent Assignment
Reel/Frame 051992/0122
Assignment of Assignor's Interest
Recorded: 2020-03-03
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Systems and Methods for Wafer Bond Monitoring