Patent Assignment
Reel/Frame 051996/0683
Assignment of Assignor's Interest
Recorded: 2020-02-22
Pages: 4
Assignors
WAN, ZHIMIN
Executed: 2019-11-11
JHA, CHANDRA MOHAN
Executed: 2019-11-08
CHANG, JE-YOUNG
Executed: 2019-11-08
CHIU, CHIA-PIN
Executed: 2019-11-08
WANG, LIWEI
Executed: 2019-11-11
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
3D Buildup of Thermally Conductive Layers to Resolve Die Height Differences
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.