Patent Assignment
Reel/Frame 051996/0756
Assignment of Assignor's Interest
Recorded: 2020-02-22
Pages: 3
Assignor
CHAVALI, SRI CHAITRA JYOTSNA
Executed: 2019-10-25
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Hybrid Core Substrate Architecture for High Speed Signaling and Fli/Sli Reliability and Its Making