Patent Assignment
Reel/Frame 051998/0412
Assignment of Assignor's Interest
Recorded: 2020-02-22
Pages: 4
Assignors
LI, WEI
Executed: 2019-09-24
CETEGEN, EDVIN
Executed: 2019-09-24
HAEHN, NICHOLAS S.
Executed: 2019-09-24
VISWANATH, RAM S.
Executed: 2019-09-30
NEAL, NICHOLAS
Executed: 2019-09-24
MODI, MITUL
Executed: 2019-09-24
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
No Mold Shelf Package Design and Process Flow for Advanced Package Architectures