IP Library Assignment 051998/0450
Patent Assignment
Reel/Frame 051998/0450

Assignment of Assignor's Interest

Recorded: 2020-02-22 Pages: 3
Assignors
WAN, ZHIMIN
Executed: 2019-11-18
CHIU, CHIA-PIN
Executed: 2019-11-09
LI, PENG
Executed: 2019-11-18
DEVASENATHIPATHY, SHANKAR
Executed: 2019-11-08
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Stim/Liquid Metal Filled Laser Drill Trench to Improve Cooling of Stacked Bottom Die
Application: 16/721,807 →
Publication: US 2021/0193548
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072851/0056 →