Patent Assignment
Reel/Frame 051998/0878
Assignment of Assignor's Interest
Recorded: 2020-03-03
Pages: 5
Assignors
YAMAGISHI, HAJIME
Executed: 2019-12-10
HIDA, SHOTA
Executed: 2019-12-13
KOBAYASHI, YUUSAKU
Executed: 2019-12-18
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 243-0014, JAPAN
Covered Property
(1)
Imaging Device and Electronic Device Configured by Bonding a Plurality of Semiconductor Substrates Including a First Multilayer Having a First Vertical Signal Line Formed in a Differrent Layer Than the Layer of a First Wiring of a First Connection Region