Patent Assignment
Reel/Frame 052014/0087
Assignment of Assignor's Interest
Recorded: 2020-03-04
Pages: 7
Assignors
JEE, YOUNG KUN
Executed: 2019-10-17
YU, HAE-JUNG
Executed: 2019-10-17
KIM, SANGWON
Executed: 2019-10-17
KANG, UN-BYOUNG
Executed: 2019-10-17
LEE, JONGHO
Executed: 2019-10-17
KIM, DAE-WOO
Executed: 2019-10-25
LEE, WONJAE
Executed: 2019-10-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Dummy Pads and Method of Manufacturing Semiconductor Package Having Dummy Pads