Patent Assignment
Reel/Frame 052021/0546
Assignment of Assignor's Interest
Recorded: 2020-03-05
Pages: 7
Assignors
KIM, JONGYOUN
Executed: 2019-12-20
PARK, JUNGHO
Executed: 2019-12-20
LEE, SEOKHYUN
Executed: 2019-12-20
JANG, YEONHO
Executed: 2019-12-20
JANG, JAEGWON
Executed: 2019-12-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.