Patent Assignment
Reel/Frame 052023/0179
Assignment of Assignor's Interest
Recorded: 2020-03-05
Pages: 5
Assignors
YOSHINO, KENJI
Executed: 2020-02-03
KARATSU, MAKOTO
Executed: 2020-02-05
NAGAOKA, TAKASHI
Executed: 2020-02-03
Assignee
SHOWA DENKO PACKAGING CO., LTD.
31, SUZUKAWA, ISEHARA-SHI, KANAGAWA, 259-1146, JAPAN
Covered Property
(1)
Molding Packaging Material, Power Storage Device Packaging Case, and Power Storage Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.