Patent Assignment
Reel/Frame 052027/0090
Assignment of Assignor's Interest
Recorded: 2020-03-05
Pages: 3
Assignors
BERNSTSON, ROSS B.
Executed: 2017-12-04
HISERT, JAMES E.
Executed: 2017-12-04
JARRETT, ROBERT N.
Executed: 2017-12-04
ROSS, JORDAN P.
Executed: 2017-12-05
Assignee
INDIUM CORPORATION
111 BUSINESS PARK DRIVE, UTICA, NEW YORK, 13502
Covered Property
(1)
Semiconductor Device Assembly Having a Thermal Interface Bond Between a Semiconductor Die and a Passive Heat Exchanger