Patent Assignment
Reel/Frame 052038/0166
Assignment of Assignor's Interest
Recorded: 2020-03-06
Pages: 7
Assignors
LEE, DONGJUN
Executed: 2019-12-11
KIM, KEUNNAM
Executed: 2019-12-11
KIM, DAEHYOUN
Executed: 2019-12-11
PARK, TAEJIN
Executed: 2019-12-11
HAN, SUNGHEE
Executed: 2019-12-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming Patterns, Integrated Circuit Device, and Method of Manufacturing the Integrated Circuit Device