Patent Assignment
Reel/Frame 052041/0607
Assignment of Assignor's Interest
Recorded: 2020-03-06
Pages: 4
Assignors
TSAI, PO-HAO
Executed: 2020-02-25
CHUANG, PO-YAO
Executed: 2020-02-25
LIN, MENG-LIANG
Executed: 2020-02-25
WU, YI-WEN
Executed: 2020-02-25
JENG, SHIN-PUU
Executed: 2020-02-25
WONG, TECHI
Executed: 2020-02-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Dual-sided Routing in 3D SiP Structure