Patent Assignment
Reel/Frame 052046/0111
Assignment of Assignor's Interest
Recorded: 2020-03-06
Pages: 4
Assignors
WANG, CHEN-CHAO
Executed: 2020-03-05
TSAI, TSUNG-TANG
Executed: 2020-03-05
HUANG, CHIH-YI
Executed: 2020-03-05
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Package Structure and Testing Method