Patent Assignment
Reel/Frame 052046/0214
Assignment of Assignor's Interest
Recorded: 2020-03-07
Pages: 2
Assignors
WU, JIUN YI
Executed: 2019-09-24
YU, CHEN-HUA
Executed: 2019-09-24
LIU, CHUNG-SHI
Executed: 2019-09-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Fan-Out Device