Patent Assignment
Reel/Frame 052050/0566
Assignment of Assignor's Interest
Recorded: 2020-03-09
Pages: 5
Assignors
HWANG, MI SUN
Executed: 2020-02-18
BYUN, DAE JUNG
Executed: 2020-02-24
PARK, CHANG HWA
Executed: 2020-02-24
JEONG, SANG HO
Executed: 2020-02-18
JANG, JUN HYEONG
Executed: 2020-02-24
NA, KI HO
Executed: 2020-02-24
PARK, JE SANG
Executed: 2020-02-24
LEE, YONG DUK
Executed: 2020-02-24
CHA, YOO RIM
Executed: 2020-02-24
PARK, YEO IL
Executed: 2020-02-24
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Having Electronic Component Embedded Therein