Patent Assignment
Reel/Frame 052050/0952
Assignment of Assignor's Interest
Recorded: 2020-02-28
Pages: 6
Assignors
PARK, MYUNGJOO
Executed: 2019-12-17
HWANG, JAEWON
Executed: 2019-12-17
MOON, KWANGJIN
Executed: 2019-12-17
PARK, KUNSANG
Executed: 2019-12-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Through Substrate Vias and Method of Manufacturing the Semiconductor Device