Patent Assignment
Reel/Frame 052062/0405
Assignment of Assignor's Interest
Recorded: 2020-03-10
Pages: 4
Assignee
MEDIATEK INC.
NO. 1, DUSING 1ST RD., HSINCHU SCIENCE PARK, HSINCHU CITY, 30078, TAIWAN
Covered Property
(1)
Semiconductor Package Structure