Patent Assignment
Reel/Frame 052064/0859
Assignment of Assignor's Interest
Recorded: 2020-03-02
Pages: 3
Assignors
BAI, YIQUN
Executed: 2020-02-27
MEHTA, VIPUL
Executed: 2020-02-27
DECKER, JOHN
Executed: 2020-02-27
LIN, ZIYIN
Executed: 2020-02-27
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
High Thermal Conductivity, High Modulus Structure Within a Mold Material Layer of an Integrated Circuit Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.