Patent Assignment
Reel/Frame 052074/0578
Assignment of Assignor's Interest
Recorded: 2020-03-10
Pages: 4
Assignor
TEI, SHINSUKE
Executed: 2020-01-27
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Wire Bonding Apparatus and Manufacturing Method for Semiconductor Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.