Patent Assignment
Reel/Frame 052078/0032
Assignment of Assignor's Interest
Recorded: 2020-03-11
Pages: 3
Assignors
LEE, SEUNG EUN
Executed: 2020-02-27
KIM, YONG HOON
Executed: 2020-02-27
KO, KYUNG HWAN
Executed: 2020-03-02
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Component Embedded Substrate
Patent:
10,881,004 →
Application:
16/812,972 →