IP Library › Assignment 052085/0086
Patent Assignment
Reel/Frame 052085/0086

Assignment of Assignor's Interest

Recorded: 2020-03-11 Pages: 4
Assignors
CHAVA, BHARANI
Executed: 2020-02-05
SONG, STANLEY SEUNGCHUL
Executed: 2020-02-07
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property (1)
Metal Filling in a Dielectric Layer Under Metal Layer One (M1)and Above an Active Device Layer in Semiconductor Devices
Application: 16/743,350 →
Publication: US 2021/0217697