Patent Assignment
Reel/Frame 052090/0532
Assignment of Assignor's Interest
Recorded: 2020-03-11
Pages: 4
Assignor
NAKAMURA, TOMONORI
Executed: 2020-01-31
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Bonding Condition Evaluation Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.