Patent Assignment
Reel/Frame 052096/0361
Assignment of Assignor's Interest
Recorded: 2020-03-12
Pages: 6
Assignors
KIM, SUNCHUL
Executed: 2020-01-17
OH, KYUNGSUK
Executed: 2020-01-16
KIM, TAEHUN
Executed: 2020-01-16
KIM, PYOUNGWAN
Executed: 2020-01-20
LEE, SOOHWAN
Executed: 2020-01-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Molding Member and Heat Dissipation Member