Patent Assignment
Reel/Frame 052100/0679
Assignment of Assignor's Interest
Recorded: 2020-03-12
Pages: 6
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Air Gap Seal for Interconnect Air Gap and Method of Fabricating Thereof