Patent Assignment
Reel/Frame 052103/0572
Assignment of Assignor's Interest
Recorded: 2020-03-12
Pages: 4
Assignor
NAKATANI, KIMIHIKO
Executed: 2020-02-14
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium