Patent Assignment
Reel/Frame 052106/0242
Assignment of Assignor's Interest
Recorded: 2020-03-13
Pages: 5
Assignors
WAN, MING YEUNG LUKE
Executed: 2020-01-23
CHEUNG, WAI KIN
Executed: 2020-01-23
CHEUNG, YU FU
Executed: 2020-01-23
Assignee
ASM TECHNOLOGY SINGAPORE PTE LTD
2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE
Covered Property
(1)
High Precision Bonding Apparatus Comprising Heater
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.