Patent Assignment
Reel/Frame 052112/0122
Assignment of Assignor's Interest
Recorded: 2020-03-13
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Non-Conductive Film Between Package Substrate and Semiconductor Chip Thereon