Patent Assignment
Reel/Frame 052112/0986
Assignment of Assignor's Interest
Recorded: 2020-03-13
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Package for High-Speed Data Transmission and Manufacturing Method Thereof