Patent Assignment
Reel/Frame 052119/0329
Assignment of Assignor's Interest
Recorded: 2019-07-03
Pages: 10
Assignors
CHEN, JUN
Executed: 2019-05-23
ZHANG, MING
Executed: 2019-05-23
CHEN, QICHENG
Executed: 2019-05-23
LIU, HUAN
Executed: 2019-05-23
Assignees
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
XINZHAN INDUSTRIAL PARK, HEFEI, ANHUI, 230012, CHINA
BOE TECHNOLOGY GROUP CO., LTD.
NO. 10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
Covered Property
(1)
Electronic Substrate and Manufacture Method Thereof, and Electronic Device