Patent Assignment
Reel/Frame 052126/0014
Assignment of Assignor's Interest
Recorded: 2020-03-16
Pages: 7
Assignors
PARK, HYESUNG
Executed: 2019-12-12
BAE, JINWOO
Executed: 2019-12-12
KOH, YOUNGHO
Executed: 2019-12-12
PARK, JONGHYUK
Executed: 2019-12-12
YOON, BOUN
Executed: 2019-12-17
JANG, MYUNGJAE
Executed: 2019-12-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO,, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and a Fabrication Method Thereof