Patent Assignment
Reel/Frame 052129/0199
Assignment of Assignor's Interest
Recorded: 2020-03-16
Pages: 4
Assignors
HSU, SEN-KUEI
Executed: 2020-02-14
PAN, HSIN-YU
Executed: 2020-02-17
CHIANG, YI-CHE
Executed: 2020-02-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof