Patent Assignment
Reel/Frame 052138/0978
Assignment of Assignor's Interest
Recorded: 2020-03-17
Pages: 4
Assignors
YANG, DEOKKYUNG
Executed: 2017-08-29
LEE, HUNTEAK
Executed: 2017-09-04
LEE, HEESOO
Executed: 2017-08-26
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming a 3D Integrated System-in-Package Module
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.