Patent Assignment
Reel/Frame 052169/0253
Assignment of Assignor's Interest
Recorded: 2020-03-19
Pages: 4
Assignors
HSU, CHIA-KUEI
Executed: 2020-03-06
YEW, MING-CHIH
Executed: 2020-03-06
LIN, PO-YAO
Executed: 2020-03-10
CHEN, SHUO-MAO
Executed: 2020-03-06
HSU, FENG-CHENG
Executed: 2020-03-06
JENG, SHIN-PUU
Executed: 2020-03-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Reinforcing Package Using Reinforcing Patches