Patent Assignment
Reel/Frame 052169/0602
Assignment of Assignor's Interest
Recorded: 2020-03-19
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Package Structure with Molding Layer and Method for Forming the Same