Patent Assignment
Reel/Frame 052171/0540
Assignment of Assignor's Interest
Recorded: 2020-03-19
Pages: 8
Assignors
KARPOV, ELIJAH
Executed: 2020-03-17
CHANDHOK, MANISH
Executed: 2020-03-18
KABIR, NAFEES
Executed: 2020-03-17
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Planar Slab Vias for Integrated Circuit Interconnects