Patent Assignment
Reel/Frame 052185/0216
Assignment of Assignor's Interest
Recorded: 2020-03-21
Pages: 7
Assignors
YANG, DEOKKYUNG
Executed: 2017-03-13
KIM, YONGMIN
Executed: 2017-03-13
CHOI, JAEHYUK
Executed: 2017-03-13
KO, YEOCHAN
Executed: 2017-03-13
LEE, HEESOO
Executed: 2017-03-13
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
System-in-Package with Double-Sided Molding
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.