Patent Assignment
Reel/Frame 052192/0209
Assignment of Assignor's Interest
Recorded: 2020-03-23
Pages: 3
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Image Sensor Package Including Bonding Wire Inside Support Member