Patent Assignment
Reel/Frame 052211/0183
Assignment of Assignor's Interest
Recorded: 2020-03-24
Pages: 8
Assignors
JIANG, HAO
Executed: 2019-11-05
LU, CHI
Executed: 2019-03-05
REN, HE
Executed: 2019-11-05
LANG, CHI-I
Executed: 2019-11-05
HWANG, HO-YUNG DAVID
Executed: 2019-11-05
NAIK, MEHUL
Executed: 2020-03-23
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Method of Forming Interconnect for Semiconductor Device