Patent Assignment
Reel/Frame 052220/0846
Assignment of Assignor's Interest
Recorded: 2020-03-25
Pages: 12
Assignors
THEI, KONG-BENG
Executed: 2018-07-24
YAUNG, DUN-NIAN
Executed: 2018-09-13
FAN, FU-JIER
Executed: 2018-07-24
LIN, HSING-CHIH
Executed: 2018-10-05
TUAN, HSIAO-CHIN
Executed: 2018-09-10
LIU, JEN-CHENG
Executed: 2018-09-17
KALNITSKY, ALEXANDER
Executed: 2018-07-28
CHEN, YI-SHENG
Executed: 2018-07-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Through Silicon via Design for Stacking Integrated Circuits